Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist

S. Tuomikoski; S. Franssila

Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist

Koulun palvelutoiminnot

Tutkimustuotos: Lehtiartikkeli › Article › Scientific › vertaisarvioitu

22 Sitaatiot (Scopus)

Alkuperäiskieli	Englanti
Sivut	223-226
Julkaisu	Physica Scripta
Numero	T114
Tila	Julkaistu - 2004
OKM-julkaisutyyppi	A1 Julkaistu artikkeli, soviteltu

Tutkimusalat

adhesive bonding
microchannel and cavity
photoresist
SU-8

Pääsy asiakirjaan

http://www.physica.org/asp/document.asp?article=114p01a00223

Siteeraa tätä

Tuomikoski, S., & Franssila, S. (2004). Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist. Physica Scripta, (T114), 223-226.

@article{19b4e4f7727b4f0087dbeb2a18e84031,

title = "Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist",

keywords = "adhesive bonding, microchannel and cavity, photoresist, SU-8, adhesive bonding, microchannel and cavity, photoresist, SU-8, adhesive bonding, microchannel and cavity, photoresist, SU-8",

author = "S. Tuomikoski and S. Franssila",

year = "2004",

language = "English",

pages = "223--226",

journal = "Physica Scripta",

issn = "0031-8949",

publisher = "IOP Publishing Ltd.",

number = "T114",

}

TY - JOUR

T1 - Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist

AU - Tuomikoski, S.

AU - Franssila, S.

PY - 2004

Y1 - 2004

KW - adhesive bonding

KW - microchannel and cavity

KW - photoresist

KW - SU-8

KW - adhesive bonding

KW - microchannel and cavity

KW - photoresist

KW - SU-8

KW - adhesive bonding

KW - microchannel and cavity

KW - photoresist

KW - SU-8

UR - http://www.physica.org/asp/document.asp?article=114p01a00223

M3 - Article

SP - 223

EP - 226

JO - Physica Scripta

JF - Physica Scripta

SN - 0031-8949

IS - T114

ER -