Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies

Jingshi Meng; Toni T. Mattila; Abhijit Dasgupta; Markku Sillanpää; Reino Jaakkola; Klas Anderson; Esa Hussa

Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies

Jingshi Meng
, Toni T. Mattila
, Abhijit Dasgupta
, Markku Sillanpää
, Reino Jaakkola
, Klas Anderson
, Esa Hussa

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

16 Sitaatiot (Scopus)

Alkuperäiskieli	Englanti
Otsikko	13th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE), Lisbon, Portugal, April 16-17-18, 2012
Sivut	1-8
Tila	Julkaistu - 2012
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

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Siteeraa tätä

Meng, J., Mattila, T. T., Dasgupta, A., Sillanpää, M., Jaakkola, R., Anderson, K., & Hussa, E. (2012). Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies. teoksessa 13th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE), Lisbon, Portugal, April 16-17-18, 2012 (Sivut 1-8)

@inproceedings{856277f0a909483882e6366f3fffb732,

title = "Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies",

author = "Jingshi Meng and Mattila, \{Toni T.\} and Abhijit Dasgupta and Markku Sillanp{\"a}{\"a} and Reino Jaakkola and Klas Anderson and Esa Hussa",

year = "2012",

language = "English",

pages = "1--8",

booktitle = "13th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE), Lisbon, Portugal, April 16-17-18, 2012",

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Meng, J, Mattila, TT, Dasgupta, A, Sillanpää, M, Jaakkola, R, Anderson, K & Hussa, E 2012, Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies. julkaisussa 13th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE), Lisbon, Portugal, April 16-17-18, 2012. Sivut 1-8.

Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies. / Meng, Jingshi; Mattila, Toni T.; Dasgupta, Abhijit et al.
13th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE), Lisbon, Portugal, April 16-17-18, 2012. 2012. s. 1-8.

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

TY - GEN

T1 - Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies

AU - Meng, Jingshi

AU - Mattila, Toni T.

AU - Dasgupta, Abhijit

AU - Sillanpää, Markku

AU - Jaakkola, Reino

AU - Anderson, Klas

AU - Hussa, Esa

PY - 2012

Y1 - 2012

UR - http://ieeexplore.ieee.org/Xplore/guesthome.jsp

M3 - Conference article in proceedings

SP - 1

EP - 8

BT - 13th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE), Lisbon, Portugal, April 16-17-18, 2012

ER -

Meng J, Mattila TT, Dasgupta A, Sillanpää M, Jaakkola R, Anderson K et al. Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies. julkaisussa 13th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE), Lisbon, Portugal, April 16-17-18, 2012. 2012. s. 1-8