Tantalum-based diffusion barriers for copper metallization

T. Laurila; K. Zeng; J. Kivilahti

Tantalum-based diffusion barriers for copper metallization

T. Laurila, K. Zeng, J. Kivilahti

Tutkimustuotos: Työpaperi › Working paper › Professional

Alkuperäiskieli	Englanti
Kustantaja	TKK
Sivumäärä	37
Tila	Julkaistu - 1999
OKM-julkaisutyyppi	D4 Julkaistut kehitykset tai tutkimusraportit tai tutkimukset

Julkaisusarja

Nimi	Report series HUT-EPT
Numero	1

Tutkimusalat

copper
diffusion barrier
tantalum
thermodynamics

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Koko teksti

Siteeraa tätä

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title = "Tantalum-based diffusion barriers for copper metallization",

keywords = "copper, diffusion barrier, tantalum, thermodynamics, copper, diffusion barrier, tantalum, thermodynamics, copper, diffusion barrier, tantalum, thermodynamics",

author = "T. Laurila and K. Zeng and J. Kivilahti",

year = "1999",

language = "English",

series = "Report series HUT-EPT",

publisher = "TKK",

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TY - UNPB

T1 - Tantalum-based diffusion barriers for copper metallization

AU - Laurila, T.

AU - Zeng, K.

AU - Kivilahti, J.

PY - 1999

Y1 - 1999

KW - copper

KW - diffusion barrier

KW - tantalum

KW - thermodynamics

KW - copper

KW - diffusion barrier

KW - tantalum

KW - thermodynamics

KW - copper

KW - diffusion barrier

KW - tantalum

KW - thermodynamics

M3 - Working paper

T3 - Report series HUT-EPT

BT - Tantalum-based diffusion barriers for copper metallization

PB - TKK

ER -