Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Joseph Hotchkiss; Vesa Vuorinen; Hongqun Dong; Glenn Ross; Jani Kaaos; Mervi Paulasto-Krockel; Tobias Wernicke; Anneliese Ponninger

doi:10.1109/ESTC48849.2020.9229696

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger

EV Group

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

4 Sitaatiot (Scopus)

265 Lataukset (Pure)

Abstrakti

The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range of temperatures and the results cover optimized wafer-level bonding process, the formation of the bond microstructure, mechanical performance, as well as the effects of thermal aging.

Alkuperäiskieli	Englanti
Otsikko	Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
Kustantaja	IEEE
Sivumäärä	5
ISBN (elektroninen)	9781728162928
DOI - pysyväislinkit	https://doi.org/10.1109/ESTC48849.2020.9229696
Tila	Julkaistu - 15 syysk. 2020
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa
Tapahtuma	Electronics System-Integration Technology Conference - Virtual conference, Tonsberg, Vestfold, Norja Kesto: 15 syysk. 2020 → 18 syysk. 2020 Konferenssinumero: 8

Conference

Conference	Electronics System-Integration Technology Conference
Lyhennettä	ESTC
Maa/Alue	Norja
Kaupunki	Tonsberg, Vestfold
Ajanjakso	15/09/2020 → 18/09/2020
Muu	Virtual conference

Pääsy asiakirjaan

10.1109/ESTC48849.2020.9229696

ELEC_Hotchkiss_etal_Study-of-Cu-Sn-In_ESTC2020_acceptedauthormanuscriptAccepted author manuscript, 20,3 MB

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Link to publication in Scopus

APPLAUSE: ECSEL18- APPLAUSE -Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M., Emadi, F., Nieminen, T., Ross, G., Tiwary, N., Golim, O. & Vuorinen, V.
01/05/2019 → 31/10/2022
Projekti: Business Finland: Other research funding

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Siteeraa tätä

Hotchkiss, J., Vuorinen, V., Dong, H., Ross, G., Kaaos, J., Paulasto-Krockel, M., Wernicke, T., & Ponninger, A. (2020). Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding. teoksessa Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020 Artikkeli 9229696 IEEE. https://doi.org/10.1109/ESTC48849.2020.9229696

@inproceedings{27a243c7a6a74ae8a30b47c0fdeec56a,

title = "Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding",

abstract = "The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range of temperatures and the results cover optimized wafer-level bonding process, the formation of the bond microstructure, mechanical performance, as well as the effects of thermal aging.",

keywords = "Copper, Indium, Tin",

author = "Joseph Hotchkiss and Vesa Vuorinen and Hongqun Dong and Glenn Ross and Jani Kaaos and Mervi Paulasto-Krockel and Tobias Wernicke and Anneliese Ponninger",

note = "| openaire: EC/H2020/826588/EU//APPLAUSE; Electronics System-Integration Technology Conference, ESTC ; Conference date: 15-09-2020 Through 18-09-2020",

year = "2020",

month = sep,

day = "15",

doi = "10.1109/ESTC48849.2020.9229696",

language = "English",

booktitle = "Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020",

publisher = "IEEE",

address = "United States",

}

Hotchkiss, J, Vuorinen, V, Dong, H, Ross, G, Kaaos, J, Paulasto-Krockel, M, Wernicke, T & Ponninger, A 2020, Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding. julkaisussa Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020., 9229696, IEEE, Electronics System-Integration Technology Conference, Tonsberg, Vestfold, Norja, 15/09/2020. https://doi.org/10.1109/ESTC48849.2020.9229696

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding. / Hotchkiss, Joseph; Vuorinen, Vesa; Dong, Hongqun et al.
Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. IEEE, 2020. 9229696.

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

TY - GEN

T1 - Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

AU - Hotchkiss, Joseph

AU - Vuorinen, Vesa

AU - Dong, Hongqun

AU - Ross, Glenn

AU - Kaaos, Jani

AU - Paulasto-Krockel, Mervi

AU - Wernicke, Tobias

AU - Ponninger, Anneliese

N1 - Conference code: 8

PY - 2020/9/15

Y1 - 2020/9/15

N2 - The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range of temperatures and the results cover optimized wafer-level bonding process, the formation of the bond microstructure, mechanical performance, as well as the effects of thermal aging.

AB - The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range of temperatures and the results cover optimized wafer-level bonding process, the formation of the bond microstructure, mechanical performance, as well as the effects of thermal aging.

KW - Copper

KW - Indium

KW - Tin

UR - http://www.scopus.com/inward/record.url?scp=85096579465&partnerID=8YFLogxK

U2 - 10.1109/ESTC48849.2020.9229696

DO - 10.1109/ESTC48849.2020.9229696

M3 - Conference article in proceedings

AN - SCOPUS:85096579465

BT - Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020

PB - IEEE

T2 - Electronics System-Integration Technology Conference

Y2 - 15 September 2020 through 18 September 2020

ER -

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

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Conference

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Projektit

APPLAUSE: ECSEL18- APPLAUSE -Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

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