R.F.-sputtered tantalum-based diffusion barriers between copper and silicon

J.M.T. Molarius, T. Laurila, K. Zeng, I. Suni, J.K. Kivilahti

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

Alkuperäiskieli	Englanti
Otsikko	11th International Conference on Thin Films, Can Cun Mexico, 30.Augusti - 3.September 1999
Sivut	s.
Tila	Julkaistu - 1999
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

Tutkimusalat

@inproceedings{a2a64c77c3fc4717918ccebb99a1c746,

title = "R.F.-sputtered tantalum-based diffusion barriers between copper and silicon",

keywords = "AFM,, mocrostructure, sputtering, AFM,, mocrostructure, sputtering, AFM,, mocrostructure, sputtering",

author = "J.M.T. Molarius and T. Laurila and K. Zeng and I. Suni and J.K. Kivilahti",

year = "1999",

language = "English",

pages = "s.",

booktitle = "11th International Conference on Thin Films, Can Cun Mexico, 30.Augusti - 3.September 1999",

}

TY - GEN

T1 - R.F.-sputtered tantalum-based diffusion barriers between copper and silicon

AU - Molarius, J.M.T.

AU - Laurila, T.

AU - Zeng, K.

AU - Suni, I.

AU - Kivilahti, J.K.

PY - 1999

Y1 - 1999

KW - AFM,

KW - mocrostructure

KW - sputtering

KW - AFM,

KW - mocrostructure

KW - sputtering

KW - AFM,

KW - mocrostructure

KW - sputtering

M3 - Conference article in proceedings

SP - s.

BT - 11th International Conference on Thin Films, Can Cun Mexico, 30.Augusti - 3.September 1999

ER -