Reliability of Microjoints in Electronics Assemblies

J. Kivilahti

Reliability of Microjoints in Electronics Assemblies

J. Kivilahti

Rakennetun ympäristön laitos

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

Alkuperäiskieli	Englanti
Otsikko	The Proc. of the International Nokia Interconnection and Packaging Colloqium, Nokia research Centre Helsinki, 28.3.1996
Sivut	28
Tila	Julkaistu - 1996
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

Tutkimusalat

electronics assemblies
microjoints
reliability

Siteeraa tätä

@inproceedings{7409f6018ecf4b91bfa2907b698ba283,

title = "Reliability of Microjoints in Electronics Assemblies",

keywords = "electronics assemblies, microjoints, reliability, electronics assemblies, microjoints, reliability, electronics assemblies, microjoints, reliability",

author = "J. Kivilahti",

year = "1996",

language = "English",

pages = "28",

booktitle = "The Proc. of the International Nokia Interconnection and Packaging Colloqium, Nokia research Centre Helsinki, 28.3.1996",

}

TY - GEN

T1 - Reliability of Microjoints in Electronics Assemblies

AU - Kivilahti, J.

PY - 1996

Y1 - 1996

KW - electronics assemblies

KW - microjoints

KW - reliability

KW - electronics assemblies

KW - microjoints

KW - reliability

KW - electronics assemblies

KW - microjoints

KW - reliability

M3 - Conference article in proceedings

SP - 28

BT - The Proc. of the International Nokia Interconnection and Packaging Colloqium, Nokia research Centre Helsinki, 28.3.1996

ER -