Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussavertaisarvioitu

Tutkijat

Organisaatiot

  • VTT Technical Research Centre of Finland

Kuvaus

The objective of this study was to develop a fully integrated process for wafer level MEMS packaging utilizing PolySi through silicon via (TSV) capped MEMS devices. First, interconnection metallurgy and Solid Liquid Interdiffusion (SLID) bonding process was optimized. Then sc.'vias before bonding' capping process and contact metallizations for Poly-Si TSVs were developed. Finally, the process integration was demonstrated by using piezoelectrically driven MEMSactuators. However, several design and manufacturing related challenges were observed and detailed failure analysis were carried out to resolve these problems.

Yksityiskohdat

AlkuperäiskieliEnglanti
OtsikkoProceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018
TilaJulkaistu - 26 marraskuuta 2018
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisuussa
TapahtumaElectronic System Integration Technology Conference - Dresden, Saksa
Kesto: 18 syyskuuta 201821 syyskuuta 2018
Konferenssinumero: 7

Conference

ConferenceElectronic System Integration Technology Conference
LyhennettäESTC
MaaSaksa
KaupunkiDresden
Ajanjakso18/09/201821/09/2018

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