Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes

Desmond Attah-Kyei*, Guven Akdogan, Daniel K. Lindberg, Christie Dorfling

*Tämän työn vastaava kirjoittaja

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussaChapterScientificvertaisarvioitu

Abstrakti

The proliferation of technology has resulted in the rise of electronic waste (e-waste) generated. The main focus of recycling e-waste has been to recover the metallic fractions from printed circuit boards (PCBs) due to the inherent high value of metals present such as gold. Hydrometallurgical route, often the most preferred option for recovering the metals, does not address the issue posed by the non-metallic part. In this study, the use of leach residue of PCB as reducing agent in hematite reduction was investigated. The analysis on the leached boards showed that PCB is highly amorphous and has carbon content of 30.10%, oxygen content of 20.1%, and ash and volatile matter of 40.1% and 44.8%, respectively. Thermodynamic modelling and laboratory-scale experiments that simulate solid-state reduction of hematite were performed using FactSage™ and single particle reactor. The results revealed that PCB can be used to partially replace conventional reducing agents.

AlkuperäiskieliEnglanti
OtsikkoMinerals, Metals and Materials Series
Sivut129-139
Sivumäärä11
DOI - pysyväislinkit
TilaJulkaistu - 1 tammikuuta 2020
OKM-julkaisutyyppiA3 Kirjan osa tai toinen tutkimuskirja

Julkaisusarja

NimiMinerals, Metals and Materials Series
ISSN (painettu)2367-1181
ISSN (elektroninen)2367-1696

Sormenjälki Sukella tutkimusaiheisiin 'Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes'. Ne muodostavat yhdessä ainutlaatuisen sormenjäljen.

  • Siteeraa tätä

    Attah-Kyei, D., Akdogan, G., Lindberg, D. K., & Dorfling, C. (2020). Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. teoksessa Minerals, Metals and Materials Series (Sivut 129-139). (Minerals, Metals and Materials Series). https://doi.org/10.1007/978-3-030-36556-1_12