MOCVD Al(Ga)N Insulator for Alternative Silicon-On-Insulator Structure

Glenn Ross, Ville Luntinen, Mikael Broas, Sami Suihkonen, Turkka Tuomi, Aapo Lankinen, Andreas Danilewsky, Markku Tilli, Mervi Paulasto-Kröckel

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussaConference article in proceedingsScientificvertaisarvioitu

1 Sitaatiot (Scopus)
208 Lataukset (Pure)

Abstrakti

Due to the functional limitations of SiO2 for SOI applications, alternative dielectric materials have been investigated. Alternative SOI materials in this work include, AlN and AlGaN. The dielectrics were deposited using MOCVD, and with the aid of PECVD deposited SiO2, and the SiO2 was directly bonded to a handle Si wafer. Tensile tests were performed on the samples to examine the fracture behavior and maximum tensile stresses, with results being comparable to a traditional SOI. Characterization was undertaken using TEM to understand the microstructural and interfacial properties of alternative SOI. High crystal quality Al(Ga)N was achieved on a Si(111) substrate that generally contained well defined chemical interfaces. Finally, synchrotron X-ray diffraction topography was used to understand the topographical strain profile of the device and handle wafers. Topography results showed different strain network properties between the device and handle wafer. This work has demonstrated preliminary feasibility of using alternative dielectrics for SOI applications.
AlkuperäiskieliEnglanti
OtsikkoProceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
KustantajaIEEE
Sivumäärä6
ISBN (elektroninen)9781728162928
DOI - pysyväislinkit
TilaJulkaistu - 15 syysk. 2020
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisussa
TapahtumaElectronics System-Integration Technology Conference - Virtual conference, Tonsberg, Vestfold, Norja
Kesto: 15 syysk. 202018 syysk. 2020
Konferenssinumero: 8

Conference

ConferenceElectronics System-Integration Technology Conference
LyhennettäESTC
Maa/AlueNorja
KaupunkiTonsberg, Vestfold
Ajanjakso15/09/202018/09/2020
MuuVirtual conference

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