Microwave and millimeter-wave characterization of conductive ink film in rectangular waveguide

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussavertaisarvioitu

Tutkijat

Organisaatiot

Kuvaus

An accurate approach to characterize the sheet impedance of thin conductive ink in rectangular waveguide is reported. This method allows retrieval of the sheet impedance without prior characterization of the supporting dielectric substrate. The ink sample is positioned between two waveguide flanges, introducing a discontinuous gap. The effect of the physical discontinuity can be removed by an additional measurement of the sample without ink layer. We have examined the extraction accuracy of the proposed method within the operating band of the waveguide, and also for various substrate thicknesses. Experimental results demonstrate the applicability of the proposed approach for sheet impedance measurements of ink films on both thin or thick (up to about quarter wavelength) substrates.

Yksityiskohdat

AlkuperäiskieliEnglanti
OtsikkoEuropean Microwave Week 2017
Alaotsikko"A Prime Year for a Prime Event", EuMW 2017 - Conference Proceedings; 47th European Microwave Conference, EuMC 2017
TilaJulkaistu - 19 joulukuuta 2017
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisuussa
TapahtumaEuropean Microwave Conference - Nuremberg, Saksa
Kesto: 10 lokakuuta 201712 lokakuuta 2017
Konferenssinumero: 47

Conference

ConferenceEuropean Microwave Conference
LyhennettäEuMC
MaaSaksa
KaupunkiNuremberg
Ajanjakso10/10/201712/10/2017

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