Microsystem integration using hybrid microassembly

This paper reports the progress of microsystem integration using hybrid microassembly, based on the recently finished EU FP7 project FAB2ASM. Hybrid microassembly is a technology that merges both highspeed coarse placement and high-accuracy self-alignment technologies. This paper addresses the basic concept of hybrid microassembly for microsystem integration and its process chain: component and interfaces, high speed and high accuracy assembly, and bonding and fixing. Issues regarding to the assembly site design for the self-alignment process will be discussed in details. Different variations of hybrid assembly processes will also be addressed. Finally, the paper discusses the applications of hybrid microassembly technology in: i) integration of microchips on lead-frames, ii) integration of surface emitting lasers, and iii) 3D integration of thin chips. The applicability of hybrid microassembly in other applications will also be discussed.