Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging

Antti Rautiainen, Elmeri Österlund, Hongbo Xu, Vesa Vuorinen, Mervi Paulasto-Kröckel

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference contribution › Professional

Alkuperäiskieli	Englanti
Otsikko	Electronic Materials, Processes and Packaging for Space (EMPPS), ESA ESTEC, Netherlands, May 20-22, 2014
Tila	Julkaistu - 2014
OKM-julkaisutyyppi	D3 Ammatillisen konferenssin julkaisusarja

OpenUrl-saatavuus

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title = "Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging",

author = "Antti Rautiainen and Elmeri {\"O}sterlund and Hongbo Xu and Vesa Vuorinen and Mervi Paulasto-Kr{\"o}ckel",

year = "2014",

language = "English",

booktitle = "Electronic Materials, Processes and Packaging for Space (EMPPS), ESA ESTEC, Netherlands, May 20-22, 2014",

}

TY - GEN

T1 - Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging

AU - Rautiainen, Antti

AU - Österlund, Elmeri

AU - Xu, Hongbo

AU - Vuorinen, Vesa

AU - Paulasto-Kröckel, Mervi

PY - 2014

Y1 - 2014

M3 - Conference contribution

BT - Electronic Materials, Processes and Packaging for Space (EMPPS), ESA ESTEC, Netherlands, May 20-22, 2014

ER -