@inbook{0548564e4a6446f7bb875e9d236f367f,
title = "Low-temperature processes for MEMS device fabrication",
abstract = "The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.",
keywords = "Amorphous etals, Fusion bonding, HF-vapour etching, MEMS, Thin film technology",
author = "Jyrki Kiiham{\"a}ki and Hannu Kattelus and Martti Blomberg and Riikka Puurunen and Mari Laamanen and Panu Pekko and Jaakko Saarilahti and Heini Ritala and Anna Rissanen",
year = "2010",
doi = "10.1007/978-90-481-3807-4-13",
language = "English",
isbn = "9789048138050",
series = "NATO Science for Peace and Security Series B: Physics and Biophysics",
pages = "167--178",
booktitle = "Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators",
}