Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Hongtao Chen; Maik Mueller; Toni Tuomas Mattila; Jue Li; Xuwei Liu; Klaus-Juerger Wolter; Mervi Paulasto-Kröckel

doi:10.1557/jmr.2011.197

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Hongtao Chen
, Maik Mueller
, Toni Tuomas Mattila
, Jue Li
, Xuwei Liu
, Klaus-Juerger Wolter
, Mervi Paulasto-Kröckel

Tutkimustuotos: Lehtiartikkeli › Article › Scientific › vertaisarvioitu

50 Sitaatiot (Scopus)

Alkuperäiskieli	Englanti
Sivut	2103-2116
Julkaisu	Journal of Materials Research
Vuosikerta	26
Numero	16
DOI - pysyväislinkit	https://doi.org/10.1557/jmr.2011.197
Tila	Julkaistu - 2011
OKM-julkaisutyyppi	A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Tutkimusalat

electron back scatter difraction
orientation imaging microscopy
polarized light microscopy
recrystallization
solder interconnection

Pääsy asiakirjaan

10.1557/jmr.2011.197

Muut tiedostot ja linkit

http://journals.cambridge.org/action/displayAbstract?fromPage=online&aid=8359344

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@article{1f56fa94d3a54f22bdd460fe5664175e,

title = "Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling",

keywords = "electron back scatter difraction, orientation imaging microscopy, polarized light microscopy, recrystallization, solder interconnection, electron back scatter difraction, orientation imaging microscopy, polarized light microscopy, recrystallization, solder interconnection, electron back scatter difraction, orientation imaging microscopy, polarized light microscopy, recrystallization, solder interconnection",

author = "Hongtao Chen and Maik Mueller and Mattila, \{Toni Tuomas\} and Jue Li and Xuwei Liu and Klaus-Juerger Wolter and Mervi Paulasto-Kr{\"o}ckel",

year = "2011",

doi = "10.1557/jmr.2011.197",

language = "English",

volume = "26",

pages = "2103--2116",

journal = "Journal of Materials Research",

issn = "0884-2914",

publisher = "Springer",

number = "16",

}

TY - JOUR

T1 - Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

AU - Chen, Hongtao

AU - Mueller, Maik

AU - Mattila, Toni Tuomas

AU - Li, Jue

AU - Liu, Xuwei

AU - Wolter, Klaus-Juerger

AU - Paulasto-Kröckel, Mervi

PY - 2011

Y1 - 2011

KW - electron back scatter difraction

KW - orientation imaging microscopy

KW - polarized light microscopy

KW - recrystallization

KW - solder interconnection

KW - electron back scatter difraction

KW - orientation imaging microscopy

KW - polarized light microscopy

KW - recrystallization

KW - solder interconnection

KW - electron back scatter difraction

KW - orientation imaging microscopy

KW - polarized light microscopy

KW - recrystallization

KW - solder interconnection

UR - http://journals.cambridge.org/action/displayAbstract?fromPage=online&aid=8359344

U2 - 10.1557/jmr.2011.197

DO - 10.1557/jmr.2011.197

M3 - Article

SN - 0884-2914

VL - 26

SP - 2103

EP - 2116

JO - Journal of Materials Research

JF - Journal of Materials Research

IS - 16

ER -

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Tutkimusalat

Pääsy asiakirjaan

Muut tiedostot ja linkit

Laitteet

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