@article{43a6c3d2b5614e8ebf43baa491194b12,
title = "Liitosalusta ja piirilevy ovat yht{\"a}",
keywords = "active component integration, fully additive PWB technology, HDI substrates, IBM-technology, passive component integration, solderless, active component integration, fully additive PWB technology, HDI substrates, IBM-technology, passive component integration, solderless, active component integration, fully additive PWB technology, HDI substrates, IBM-technology, passive component integration, solderless",
author = "J. Kivilahti and Hao Yu and D. Burlacu",
year = "2000",
language = "English",
volume = "21",
pages = "75--78",
journal = "Prosessori (Elektroniikan suunnittelu -erikoisjulkaisu)",
publisher = "Sanoma Magazines",
}