In this chapter, measuring MEMS in explained in detail. Silicon-based MEMS technology is a direct offspring of the much larger silicon-integrated circuit technology. The basic fabrication processes, as well as most of the tools and materials, are based on those developed for IC manufacturing. Measurements have two main functions, process development and process control. In process development, the aim is to optimize the manufacturing process and for process control, the goal is to maintain the stability of the process. MEMS is mainly concerned with relatively large three-dimensional moving structures, the main emphasis from the device point of view is not on their electrical, but rather the structural and mechanical properties. The main characteristic of MEMS devices is that they invariably include one or several moving parts, usually cantilevers, beams, or membranes of various shapes, thicknesses, and lateral dimensions. There are several possible measurement strategies. For a given measurement to be useful, it is important that the data produced are comparable with different operators, at various locations, using different equipment. The capability of the measurement can be a severe limitation for the achievable capability of the process. The key parameters describing measurement system performance are precision and accuracy.
|Otsikko||Handbook of Silicon Based MEMS Materials and Technologies|
|DOI - pysyväislinkit|
|Tila||Julkaistu - 1 joulukuuta 2010|
|OKM-julkaisutyyppi||B2 Kirjan osa tai toinen tutkimuskirja|