Introduction to Encapsulation and Integration of MEMS

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussavertaisarvioitu

Tutkijat

Organisaatiot

  • Murata Electronics Oy

Kuvaus

In this chapter the history, status and future developments in the critical areas of MEMS encapsulation and interconnections are briefly introduced. The pressure of cost reduction and the requirements of increasing functionality are driving the miniaturization of packaging. As MEMS and sensors are entering new applications, they need to communicate and act autonomously as a system within physical dimensions which allow embedding them in everyday articles and even in flexible shapes. Therefore, wafer-level packaging and vertical via interconnections between the different components is getting more important. Closer integration of frontend and backend technologies through wafer level and 3D integration type of concepts are needed to enable higher functionality and in the same time to reduce the high manufacturing costs of MEMS packaging. This chapter looks at the main functions of hermetic encapsulation.

Yksityiskohdat

AlkuperäiskieliEnglanti
OtsikkoHandbook of Silicon Based MEMS Materials and Technologies
AlaotsikkoSecond Edition
TilaJulkaistu - 1 tammikuuta 2015
OKM-julkaisutyyppiA3 Kirjan osa tai toinen tutkimuskirja

ID: 17195581