Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel

Tutkimustuotos: Lehtiartikkeli › Article › Scientific › vertaisarvioitu

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Studies from Aalto University in the Area of Technology Described (Impact of Inherent Design Limitations for Cu-sn Slid Microbumps On Its Electromigration Reliability for 3d Ics)
Mervi Paulasto-Kröckel, Glenn Ross & Vesa Vuorinen
20/01/2023
1 kohde/ Medianäkyvyys
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