High frequency substrate technologies for the realisation of software programmable metasurfaces on pcb hardware platforms with integrated controller nodes

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussavertaisarvioitu

Standard

High frequency substrate technologies for the realisation of software programmable metasurfaces on pcb hardware platforms with integrated controller nodes. / Manessis, D.; Seckel, M.; Liu, Fu; Tsilipakos, O.; Pitilakis, A.; Tasolamprou, A.; Kossifos, K.; Varnava, G.; Liaskos, C.; Kafesaki, M.; Soukoulis, C. M.; Tretiakov, Sergei; Georgiou, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K. D.

2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019. IEEE, 2019. 8951834 (European Microelectronics and Packaging Conference).

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussavertaisarvioitu

Harvard

Manessis, D, Seckel, M, Liu, F, Tsilipakos, O, Pitilakis, A, Tasolamprou, A, Kossifos, K, Varnava, G, Liaskos, C, Kafesaki, M, Soukoulis, CM, Tretiakov, S, Georgiou, J, Ostmann, A, Aschenbrenner, R, Schneider-Ramelow, M & Lang, KD 2019, High frequency substrate technologies for the realisation of software programmable metasurfaces on pcb hardware platforms with integrated controller nodes. julkaisussa 2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019., 8951834, European Microelectronics and Packaging Conference, IEEE, European Microelectronics and Packaging Conference, Pisa, Italia, 16/09/2019. https://doi.org/10.23919/EMPC44848.2019.8951834

APA

Manessis, D., Seckel, M., Liu, F., Tsilipakos, O., Pitilakis, A., Tasolamprou, A., ... Lang, K. D. (2019). High frequency substrate technologies for the realisation of software programmable metasurfaces on pcb hardware platforms with integrated controller nodes. teoksessa 2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019 [8951834] (European Microelectronics and Packaging Conference). IEEE. https://doi.org/10.23919/EMPC44848.2019.8951834

Vancouver

Manessis D, Seckel M, Liu F, Tsilipakos O, Pitilakis A, Tasolamprou A et al. High frequency substrate technologies for the realisation of software programmable metasurfaces on pcb hardware platforms with integrated controller nodes. julkaisussa 2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019. IEEE. 2019. 8951834. (European Microelectronics and Packaging Conference). https://doi.org/10.23919/EMPC44848.2019.8951834

Author

Manessis, D. ; Seckel, M. ; Liu, Fu ; Tsilipakos, O. ; Pitilakis, A. ; Tasolamprou, A. ; Kossifos, K. ; Varnava, G. ; Liaskos, C. ; Kafesaki, M. ; Soukoulis, C. M. ; Tretiakov, Sergei ; Georgiou, J. ; Ostmann, A. ; Aschenbrenner, R. ; Schneider-Ramelow, M. ; Lang, K. D. / High frequency substrate technologies for the realisation of software programmable metasurfaces on pcb hardware platforms with integrated controller nodes. 2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019. IEEE, 2019. (European Microelectronics and Packaging Conference).

Bibtex - Lataa

@inproceedings{3d5f9ef6265e4cb4bbe5d1a8c2c3ff5f,
title = "High frequency substrate technologies for the realisation of software programmable metasurfaces on pcb hardware platforms with integrated controller nodes",
abstract = "The proposed work is performed in the framework of the FET-EU project ' VISORSURF^{J\prime}, which has undertaken research activities on the emerging concepts of metamaterials that can be software programmable and adapt their properties. In the realm of electromagnetism (EM), the field of metasurfaces (MSF) has reached significant breakthroughs in correlating the micro- or nano-structure of artificial planar materials to their end properties. MSFs exhibit physical properties not found in nature, such as negative or smaller-than-unity refraction index, allowing for EM cloaking of objects, reflection cancellation from a given surface and EM energy concentration in as-tight-as-possible spaces. The VISORSURF main objective is the development of a hardware platform, the Hypersurface, whose electromagnetic behavior can be defined programmatically. The key enablers for this are the metasurfaces whose electromagnetic properties depend on their internal structure. The Hypersurface hardware platform will be a 4-layer build-up of high frequency PCB substrate materials and will merge the metasurfaces with custom electronic controller nodes at the bottom of the PCB hardware platform. These electronic controllers build a nanonetwork which receives external programmatic commands and alters the metasurface structure, yielding a desired electromagnetic behavior for the Hypersurface platform. This paper will elaborate on how large scale PCB technologies are deployed for the economical manufacturing of the 4-layer Hypersurface PCB hardware platform with a size of 9Jx1 2J', having copper metasurface patches on the top of the board and the electronic controllers as 2mmx2mm WLCSP chips at 400\mum pitch assembled at the bottom of the platform. The PCB platform designs have stemmed from EM modeling iterations of the whole stack of high frequency laminates taking into account also the electronic features of the controller nodes. The manufacturing processes for the realization of the selected PCB architectures will be discussed in detail.",
keywords = "High frequency substrates, Metamaterials, Metasurfaces, Software defined materials",
author = "D. Manessis and M. Seckel and Fu Liu and O. Tsilipakos and A. Pitilakis and A. Tasolamprou and K. Kossifos and G. Varnava and C. Liaskos and M. Kafesaki and Soukoulis, {C. M.} and Sergei Tretiakov and J. Georgiou and A. Ostmann and R. Aschenbrenner and M. Schneider-Ramelow and Lang, {K. D.}",
note = "| openaire: EC/H2020/736876/EU//VISORSURF",
year = "2019",
month = "9",
day = "16",
doi = "10.23919/EMPC44848.2019.8951834",
language = "English",
series = "European Microelectronics and Packaging Conference",
publisher = "IEEE",
booktitle = "2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019",
address = "United States",

}

RIS - Lataa

TY - GEN

T1 - High frequency substrate technologies for the realisation of software programmable metasurfaces on pcb hardware platforms with integrated controller nodes

AU - Manessis, D.

AU - Seckel, M.

AU - Liu, Fu

AU - Tsilipakos, O.

AU - Pitilakis, A.

AU - Tasolamprou, A.

AU - Kossifos, K.

AU - Varnava, G.

AU - Liaskos, C.

AU - Kafesaki, M.

AU - Soukoulis, C. M.

AU - Tretiakov, Sergei

AU - Georgiou, J.

AU - Ostmann, A.

AU - Aschenbrenner, R.

AU - Schneider-Ramelow, M.

AU - Lang, K. D.

N1 - | openaire: EC/H2020/736876/EU//VISORSURF

PY - 2019/9/16

Y1 - 2019/9/16

N2 - The proposed work is performed in the framework of the FET-EU project ' VISORSURF^{J\prime}, which has undertaken research activities on the emerging concepts of metamaterials that can be software programmable and adapt their properties. In the realm of electromagnetism (EM), the field of metasurfaces (MSF) has reached significant breakthroughs in correlating the micro- or nano-structure of artificial planar materials to their end properties. MSFs exhibit physical properties not found in nature, such as negative or smaller-than-unity refraction index, allowing for EM cloaking of objects, reflection cancellation from a given surface and EM energy concentration in as-tight-as-possible spaces. The VISORSURF main objective is the development of a hardware platform, the Hypersurface, whose electromagnetic behavior can be defined programmatically. The key enablers for this are the metasurfaces whose electromagnetic properties depend on their internal structure. The Hypersurface hardware platform will be a 4-layer build-up of high frequency PCB substrate materials and will merge the metasurfaces with custom electronic controller nodes at the bottom of the PCB hardware platform. These electronic controllers build a nanonetwork which receives external programmatic commands and alters the metasurface structure, yielding a desired electromagnetic behavior for the Hypersurface platform. This paper will elaborate on how large scale PCB technologies are deployed for the economical manufacturing of the 4-layer Hypersurface PCB hardware platform with a size of 9Jx1 2J', having copper metasurface patches on the top of the board and the electronic controllers as 2mmx2mm WLCSP chips at 400\mum pitch assembled at the bottom of the platform. The PCB platform designs have stemmed from EM modeling iterations of the whole stack of high frequency laminates taking into account also the electronic features of the controller nodes. The manufacturing processes for the realization of the selected PCB architectures will be discussed in detail.

AB - The proposed work is performed in the framework of the FET-EU project ' VISORSURF^{J\prime}, which has undertaken research activities on the emerging concepts of metamaterials that can be software programmable and adapt their properties. In the realm of electromagnetism (EM), the field of metasurfaces (MSF) has reached significant breakthroughs in correlating the micro- or nano-structure of artificial planar materials to their end properties. MSFs exhibit physical properties not found in nature, such as negative or smaller-than-unity refraction index, allowing for EM cloaking of objects, reflection cancellation from a given surface and EM energy concentration in as-tight-as-possible spaces. The VISORSURF main objective is the development of a hardware platform, the Hypersurface, whose electromagnetic behavior can be defined programmatically. The key enablers for this are the metasurfaces whose electromagnetic properties depend on their internal structure. The Hypersurface hardware platform will be a 4-layer build-up of high frequency PCB substrate materials and will merge the metasurfaces with custom electronic controller nodes at the bottom of the PCB hardware platform. These electronic controllers build a nanonetwork which receives external programmatic commands and alters the metasurface structure, yielding a desired electromagnetic behavior for the Hypersurface platform. This paper will elaborate on how large scale PCB technologies are deployed for the economical manufacturing of the 4-layer Hypersurface PCB hardware platform with a size of 9Jx1 2J', having copper metasurface patches on the top of the board and the electronic controllers as 2mmx2mm WLCSP chips at 400\mum pitch assembled at the bottom of the platform. The PCB platform designs have stemmed from EM modeling iterations of the whole stack of high frequency laminates taking into account also the electronic features of the controller nodes. The manufacturing processes for the realization of the selected PCB architectures will be discussed in detail.

KW - High frequency substrates

KW - Metamaterials

KW - Metasurfaces

KW - Software defined materials

UR - http://www.scopus.com/inward/record.url?scp=85078849066&partnerID=8YFLogxK

U2 - 10.23919/EMPC44848.2019.8951834

DO - 10.23919/EMPC44848.2019.8951834

M3 - Conference contribution

T3 - European Microelectronics and Packaging Conference

BT - 2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019

PB - IEEE

ER -

ID: 40930923