Formation of Interfacial Microstructure in Brazing of the Silicon Nitride with Ti-Activated Ag-Cu filler alloys

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Alkuperäiskieli	Englanti
Sivut	1209-1214
Julkaisu	Scripta Metallurgica et Materialia
Vuosikerta	32
Numero	8
Tila	Julkaistu - 1995
OKM-julkaisutyyppi	A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Tutkimusalat

@article{ff5ee216cf2e426987c44dee9424782b,

title = "Formation of Interfacial Microstructure in Brazing of the Silicon Nitride with Ti-Activated Ag-Cu filler alloys",

keywords = "brazing, metals and ceramics, brazing, metals and ceramics, brazing, metals and ceramics",

author = "M. Paulasto and J. Kivilahti",

year = "1995",

language = "English",

volume = "32",

pages = "1209--1214",

journal = "Scripta Metallurgica et Materialia",

issn = "1873-2712",

publisher = "Elsevier",

number = "8",

}

TY - JOUR

T1 - Formation of Interfacial Microstructure in Brazing of the Silicon Nitride with Ti-Activated Ag-Cu filler alloys

AU - Paulasto, M.

AU - Kivilahti, J.

PY - 1995

Y1 - 1995

KW - brazing

KW - metals and ceramics

KW - brazing

KW - metals and ceramics

KW - brazing

KW - metals and ceramics

M3 - Article

SN - 1873-2712

VL - 32

SP - 1209

EP - 1214

JO - Scripta Metallurgica et Materialia

JF - Scripta Metallurgica et Materialia

IS - 8

ER -