Finite element analysis of paperboard package under compressional load

Minhaj Zaheer, Muhammad Awais, Lauri Rautkari, Joonas Sorvari

Tutkimustuotos: LehtiartikkeliArticleScientificvertaisarvioitu

12 Sitaatiot (Scopus)
273 Lataukset (Pure)

Abstrakti

Paper and paperboard based packages are widely use in domestic storage and commercial transportation applications. However, the structural integrity of the packages can be damaged with the applied compressional load. The stacking of boxes one above the other or the external load deform the thin wall of paperboard package. Moreover, the packages are also locally creased to enhance the folding. The folded edge also provide support against the deformation of the package. In this article, the effect of compressional force on paperboard packages was analyzed with the aid of finite element analysis. Two packages with and without crease were modelled and their elastic limits, stress distribution was compared. The creases were applied using hinge connectors restricting 5 degrees of freedom. Only the rotational motion is allowed that assist the folding of paperboard. The paperboard is modelled as an orthotropic elastoplastic material. The plastic behavior was defined with Hill’s yield criteria and isotropic hardening. The Eigen value analysis was performed to determine the critical forces and the buckling. The results obtained from finite element analysis show that the package with creases resist the total strains and stresses compared to the package without creases and theoretical calculations were close to the calculated values.
AlkuperäiskieliEnglanti
Sivut1162 - 1170
Sivumäärä9
JulkaisuProcedia Manufacturing
Vuosikerta17
DOI - pysyväislinkit
TilaJulkaistu - 2018
OKM-julkaisutyyppiA1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä
TapahtumaInternational Conference on Flexible Automation and Intelligent Manufacturing - Columbus, Yhdysvallat
Kesto: 11 kesäk. 201814 kesäk. 2018
Konferenssinumero: 28

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