Feasibility of lead-free Solder Alloys as Filler Materials for Z-axis Adhesives

P. Savolainen, Jorma Kivilahti

Tutkimustuotos: Lehtiartikkeli › Article › Scientific › vertaisarvioitu

1 Sitaatiot (Scopus)

Alkuperäiskieli	Englanti
Sivut	10
Julkaisu	Soldering and Surface Mount Technology
Vuosikerta	20
Numero	May
Tila	Julkaistu - 1995
OKM-julkaisutyyppi	A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Tutkimusalat

@article{f489ca52acc740639b5cbf401b740c0a,

title = "Feasibility of lead-free Solder Alloys as Filler Materials for Z-axis Adhesives",

keywords = "conductive adhesives, microelectronics, conductive adhesives, microelectronics, conductive adhesives, microelectronics",

author = "P. Savolainen and Jorma Kivilahti",

year = "1995",

language = "English",

volume = "20",

pages = "10",

journal = "Soldering and Surface Mount Technology",

issn = "1758-6836",

publisher = "Emerald",

number = "May",

}

TY - JOUR

T1 - Feasibility of lead-free Solder Alloys as Filler Materials for Z-axis Adhesives

AU - Savolainen, P.

AU - Kivilahti, Jorma

PY - 1995

Y1 - 1995

KW - conductive adhesives

KW - microelectronics

KW - conductive adhesives

KW - microelectronics

KW - conductive adhesives

KW - microelectronics

M3 - Article

SN - 1758-6836

VL - 20

SP - 10

JO - Soldering and Surface Mount Technology

JF - Soldering and Surface Mount Technology

IS - May

ER -