@techreport{f83a8d4d5d044a7794505c96476b6ba8,
title = "Evaluation of electroless copper interconnect induced strain in Si IC processing using white beam synchrotron x-ray topography, micro-Raman spectroscopy and finite element modelling",
keywords = "copper intercomects, finite element modelling, Raman spectrometry, strain, synchrotron x-ray topography, copper intercomects, finite element modelling, Raman spectrometry, strain, synchrotron x-ray topography, copper intercomects, finite element modelling, Raman spectrometry, strain, synchrotron x-ray topography",
author = "J. Kanatharana and P.J. McNally and Turkka Tuomi and B.H.W. Toh and D. McNeill and W.M. Chen and J. Riikonen and L. Knuuttila and J.J. P{\'e}rez-Camacho",
year = "2003",
language = "English",
series = "HASYLAB-DESY Annual Report 2002, Part I",
pages = "253--254",
type = "WorkingPaper",
}