Electrical Properties of Solder-filled Anisotropically Conductive Adhesives

Tutkimustuotos: Lehtiartikkeli › Article › Scientific › vertaisarvioitu

10 Viittaukset (Web of Science)

Alkuperäiskieli	Englanti
Sivut	19-26
Julkaisu	Journal of Electronics Manufacturing
Vuosikerta	5
Numero	1
Tila	Julkaistu - 1995
OKM-julkaisutyyppi	A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Tutkimusalat

@article{6995c1d311f84edda08606cf43e3e76f,

title = "Electrical Properties of Solder-filled Anisotropically Conductive Adhesives",

keywords = "conductive adhesives, microelectronics, conductive adhesives, microelectronics, conductive adhesives, microelectronics",

author = "P. Savolainen and J. Kivilahti",

year = "1995",

language = "English",

volume = "5",

pages = "19--26",

journal = "Journal of Electronics Manufacturing",

publisher = "Chapman and Hall",

number = "1",

}

TY - JOUR

T1 - Electrical Properties of Solder-filled Anisotropically Conductive Adhesives

AU - Savolainen, P.

AU - Kivilahti, J.

PY - 1995

Y1 - 1995

KW - conductive adhesives

KW - microelectronics

KW - conductive adhesives

KW - microelectronics

KW - conductive adhesives

KW - microelectronics

M3 - Article

VL - 5

SP - 19

EP - 26

JO - Journal of Electronics Manufacturing

JF - Journal of Electronics Manufacturing

IS - 1

ER -