EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE

Donald Stone, Simo-Pekka Hannula, Che Yu Li

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussaConference contributionScientificvertaisarvioitu

Abstrakti

The deformation of solder joints in microelectronic components during a thermal cycle is analyzed. The stresses encountered by a solder joint are estimated based on a geometrically simplified model of a solder joint assembly. A solder flow law that includes grain boundary sliding is incorporated into the model, which is shown to reproduce satisfactorily the measured behavior of a more complex assembly. It is suggested that this flow law can also be used to assess the different damage mechanisms and the stress-strain rate-temperature regimes in which the different damage mechanisms operate. The effects of a number of variables on the stress-time profile and solder joint fatigue during a thermal cycle are examined. These variables include the amplitude and frequency of the thermal frequency of the thermal cycle, the stiffness of the soldered assembly, and the grain size of the solder.
AlkuperäiskieliEnglanti
OtsikkoProceedings - Electronic Components and Technology Conference
KustantajaIEEE
Sivut46-51
Sivumäärä6
TilaJulkaistu - 1985
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisuussa
TapahtumaElectronic Components and Technology Conference - Washington, Yhdysvallat
Kesto: 1 tammikuuta 19851 tammikuuta 1985
Konferenssinumero: 35

Julkaisusarja

NimiProceedings - Electronic Components and Technology Conference
KustantajaIEEE
ISSN (painettu)0569-5503

Conference

ConferenceElectronic Components and Technology Conference
MaaYhdysvallat
KaupunkiWashington
Ajanjakso01/01/198501/01/1985

Sormenjälki

Sukella tutkimusaiheisiin 'EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE'. Ne muodostavat yhdessä ainutlaatuisen sormenjäljen.

Siteeraa tätä