EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE

Donald Stone; Simo-Pekka Hannula; Che Yu Li

EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE

Donald Stone
, Simo-Pekka Hannula
, Che Yu Li

Ei julkaistu Aalto-yliopiston affiliaatiolla

Cornell University

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

Abstrakti

The deformation of solder joints in microelectronic components during a thermal cycle is analyzed. The stresses encountered by a solder joint are estimated based on a geometrically simplified model of a solder joint assembly. A solder flow law that includes grain boundary sliding is incorporated into the model, which is shown to reproduce satisfactorily the measured behavior of a more complex assembly. It is suggested that this flow law can also be used to assess the different damage mechanisms and the stress-strain rate-temperature regimes in which the different damage mechanisms operate. The effects of a number of variables on the stress-time profile and solder joint fatigue during a thermal cycle are examined. These variables include the amplitude and frequency of the thermal frequency of the thermal cycle, the stiffness of the soldered assembly, and the grain size of the solder.

Alkuperäiskieli	Englanti
Otsikko	Proceedings - Electronic Components and Technology Conference
Kustantaja	IEEE
Sivut	46-51
Sivumäärä	6
Tila	Julkaistu - 1985
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa
Tapahtuma	Electronic Components and Technology Conference - Washington, Yhdysvallat Kesto: 1 tammik. 1985 → 1 tammik. 1985 Konferenssinumero: 35

Julkaisusarja

Nimi	Proceedings - Electronic Components and Technology Conference
Kustantaja	IEEE
ISSN (painettu)	0569-5503

Conference

Conference	Electronic Components and Technology Conference
Maa/Alue	Yhdysvallat
Kaupunki	Washington
Ajanjakso	01/01/1985 → 01/01/1985

Siteeraa tätä

@inproceedings{381f730533c441aeae507eea1d842855,

title = "EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE",

abstract = "The deformation of solder joints in microelectronic components during a thermal cycle is analyzed. The stresses encountered by a solder joint are estimated based on a geometrically simplified model of a solder joint assembly. A solder flow law that includes grain boundary sliding is incorporated into the model, which is shown to reproduce satisfactorily the measured behavior of a more complex assembly. It is suggested that this flow law can also be used to assess the different damage mechanisms and the stress-strain rate-temperature regimes in which the different damage mechanisms operate. The effects of a number of variables on the stress-time profile and solder joint fatigue during a thermal cycle are examined. These variables include the amplitude and frequency of the thermal frequency of the thermal cycle, the stiffness of the soldered assembly, and the grain size of the solder. ",

author = "Donald Stone and Simo-Pekka Hannula and Li, \{Che Yu\}",

year = "1985",

language = "English",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "IEEE",

pages = "46--51",

booktitle = "Proceedings - Electronic Components and Technology Conference",

address = "United States",

note = "Electronic Components and Technology Conference ; Conference date: 01-01-1985 Through 01-01-1985",

}

Stone, D, Hannula, S-P & Li, CY 1985, EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE. julkaisussa Proceedings - Electronic Components and Technology Conference. Proceedings - Electronic Components and Technology Conference, IEEE, Sivut 46-51, Electronic Components and Technology Conference, Washington, District of Columbia, Yhdysvallat, 01/01/1985.

EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE. / Stone, Donald; Hannula, Simo-Pekka; Li, Che Yu.
Proceedings - Electronic Components and Technology Conference. IEEE, 1985. s. 46-51 (Proceedings - Electronic Components and Technology Conference).

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

TY - GEN

T1 - EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE

AU - Stone, Donald

AU - Hannula, Simo-Pekka

AU - Li, Che Yu

N1 - Conference code: 35

PY - 1985

Y1 - 1985

N2 - The deformation of solder joints in microelectronic components during a thermal cycle is analyzed. The stresses encountered by a solder joint are estimated based on a geometrically simplified model of a solder joint assembly. A solder flow law that includes grain boundary sliding is incorporated into the model, which is shown to reproduce satisfactorily the measured behavior of a more complex assembly. It is suggested that this flow law can also be used to assess the different damage mechanisms and the stress-strain rate-temperature regimes in which the different damage mechanisms operate. The effects of a number of variables on the stress-time profile and solder joint fatigue during a thermal cycle are examined. These variables include the amplitude and frequency of the thermal frequency of the thermal cycle, the stiffness of the soldered assembly, and the grain size of the solder.

AB - The deformation of solder joints in microelectronic components during a thermal cycle is analyzed. The stresses encountered by a solder joint are estimated based on a geometrically simplified model of a solder joint assembly. A solder flow law that includes grain boundary sliding is incorporated into the model, which is shown to reproduce satisfactorily the measured behavior of a more complex assembly. It is suggested that this flow law can also be used to assess the different damage mechanisms and the stress-strain rate-temperature regimes in which the different damage mechanisms operate. The effects of a number of variables on the stress-time profile and solder joint fatigue during a thermal cycle are examined. These variables include the amplitude and frequency of the thermal frequency of the thermal cycle, the stiffness of the soldered assembly, and the grain size of the solder.

M3 - Conference article in proceedings

T3 - Proceedings - Electronic Components and Technology Conference

SP - 46

EP - 51

BT - Proceedings - Electronic Components and Technology Conference

PB - IEEE

T2 - Electronic Components and Technology Conference

Y2 - 1 January 1985 through 1 January 1985

ER -

EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE

Abstrakti

Julkaisusarja

Conference

Sormenjälki

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