Abstrakti
The deformation of solder joints in microelectronic components during a thermal cycle is analyzed. The stresses encountered by a solder joint are estimated based on a geometrically simplified model of a solder joint assembly. A solder flow law that includes grain boundary sliding is incorporated into the model, which is shown to reproduce satisfactorily the measured behavior of a more complex assembly. It is suggested that this flow law can also be used to assess the different damage mechanisms and the stress-strain rate-temperature regimes in which the different damage mechanisms operate. The effects of a number of variables on the stress-time profile and solder joint fatigue during a thermal cycle are examined. These variables include the amplitude and frequency of the thermal frequency of the thermal cycle, the stiffness of the soldered assembly, and the grain size of the solder.
| Alkuperäiskieli | Englanti |
|---|---|
| Otsikko | Proceedings - Electronic Components and Technology Conference |
| Kustantaja | IEEE |
| Sivut | 46-51 |
| Sivumäärä | 6 |
| Tila | Julkaistu - 1985 |
| OKM-julkaisutyyppi | A4 Artikkeli konferenssijulkaisuussa |
| Tapahtuma | Electronic Components and Technology Conference - Washington, Yhdysvallat Kesto: 1 tammikuuta 1985 → 1 tammikuuta 1985 Konferenssinumero: 35 |
Julkaisusarja
| Nimi | Proceedings - Electronic Components and Technology Conference |
|---|---|
| Kustantaja | IEEE |
| ISSN (painettu) | 0569-5503 |
Conference
| Conference | Electronic Components and Technology Conference |
|---|---|
| Maa/Alue | Yhdysvallat |
| Kaupunki | Washington |
| Ajanjakso | 01/01/1985 → 01/01/1985 |