Effect of Thermal Stresses along Crack Surface on Ultrasonic Response

Iikka Virkkunen; Mika Kemppainen; Jorma Pitkänen; Hannu Hänninen

Effect of Thermal Stresses along Crack Surface on Ultrasonic Response

Iikka Virkkunen
, Mika Kemppainen
, Jorma Pitkänen
, Hannu Hänninen

Energia- ja konetekniikan laitos

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

2 Viittaukset (Web of Science)

Alkuperäiskieli	Englanti
Otsikko	REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOLS 23A AND 23B
Toimittajat	D.O. Thompson, D.E. Chimenti
Kustantaja	American Institute of Physics
Sivut	1224-1231
Sivumäärä	8
Vuosikerta	23
Painos	A & B
ISBN (painettu)	0-7354-0173-X
Tila	Julkaistu - 2004
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa
Tapahtuma	Annual Review of Progress in Quantitative Nondestructive Evaluation - Green Bay, Yhdysvallat Kesto: 27 heinäk. 2003 → 1 elok. 2003 Konferenssinumero: 30

Conference

Conference	Annual Review of Progress in Quantitative Nondestructive Evaluation
Lyhennettä	QNDE
Maa/Alue	Yhdysvallat
Kaupunki	Green Bay
Ajanjakso	27/07/2003 → 01/08/2003

Tutkimusalat

cracking
thermal stress
ultrasonic inspection

Siteeraa tätä

@inproceedings{f62389c4b2244fde9bbdfc0d34f45cb6,

title = "Effect of Thermal Stresses along Crack Surface on Ultrasonic Response",

keywords = "cracking, thermal stress, ultrasonic inspection, cracking, thermal stress, ultrasonic inspection, cracking, thermal stress, ultrasonic inspection",

author = "Iikka Virkkunen and Mika Kemppainen and Jorma Pitk{\"a}nen and Hannu H{\"a}nninen",

year = "2004",

language = "English",

isbn = "0-7354-0173-X",

volume = "23",

pages = "1224--1231",

editor = "D.O. Thompson and D.E. Chimenti",

booktitle = "REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOLS 23A AND 23B",

publisher = "American Institute of Physics",

address = "United States",

edition = "A \& B",

note = "Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE ; Conference date: 27-07-2003 Through 01-08-2003",

}

Virkkunen, I, Kemppainen, M, Pitkänen, J & Hänninen, H 2004, Effect of Thermal Stresses along Crack Surface on Ultrasonic Response. julkaisussa DO Thompson & DE Chimenti (toim), REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOLS 23A AND 23B. A & B toim, Vuosikerta 23, American Institute of Physics, Sivut 1224-1231, Annual Review of Progress in Quantitative Nondestructive Evaluation, Green Bay, Wisconsin, Yhdysvallat, 27/07/2003.

Effect of Thermal Stresses along Crack Surface on Ultrasonic Response. / Virkkunen, Iikka; Kemppainen, Mika; Pitkänen, Jorma et al.
REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOLS 23A AND 23B. toim. / D.O. Thompson; D.E. Chimenti. Vuosikerta 23 A & B. toim. American Institute of Physics, 2004. s. 1224-1231.

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

TY - GEN

T1 - Effect of Thermal Stresses along Crack Surface on Ultrasonic Response

AU - Virkkunen, Iikka

AU - Kemppainen, Mika

AU - Pitkänen, Jorma

AU - Hänninen, Hannu

N1 - Conference code: 30

PY - 2004

Y1 - 2004

KW - cracking

KW - thermal stress

KW - ultrasonic inspection

KW - cracking

KW - thermal stress

KW - ultrasonic inspection

KW - cracking

KW - thermal stress

KW - ultrasonic inspection

M3 - Conference article in proceedings

SN - 0-7354-0173-X

VL - 23

SP - 1224

EP - 1231

BT - REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOLS 23A AND 23B

A2 - Thompson, D.O.

A2 - Chimenti, D.E.

PB - American Institute of Physics

T2 - Annual Review of Progress in Quantitative Nondestructive Evaluation

Y2 - 27 July 2003 through 1 August 2003

ER -