@article{4d981357abb34027813882ffa61c6deb,
title = "Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading",
keywords = "electromigration, interfacial reactions, electromigration, interfacial reactions, electromigration, interfacial reactions",
author = "Tomi Laurila and Juha Karppinen and Vesa Vuorinen and Jue Li and Mervi Paulasto-Kr{\"o}ckel",
year = "2012",
doi = "10.1007/s11664-012-2223-2",
language = "English",
volume = "41",
pages = "3179--3195",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer",
number = "11",
}