Effect of gelatine and thiourea on the electrodeposition of copper

Tutkimustuotos: Työpaperi › Working paper › Professional

Alkuperäiskieli	Englanti
Julkaisupaikka	Tukholma
Tila	Julkaistu - 1994
OKM-julkaisutyyppi	D4 Julkaistu kehittämis- tai tutkimusraportti taikka -selvitys

Tutkimusalat

@techreport{27e80380b80c4c0ba1f1ed9715ef012b,

title = "Effect of gelatine and thiourea on the electrodeposition of copper",

keywords = "additives, copper electrolysis, additives, copper electrolysis, additives, copper electrolysis",

author = "O. Forsen and L. Zhu and E. Antila and M.H. Tikkanen",

year = "1994",

language = "English",

type = "WorkingPaper",

}

TY - UNPB

T1 - Effect of gelatine and thiourea on the electrodeposition of copper

AU - Forsen, O.

AU - Zhu, L.

AU - Antila, E.

AU - Tikkanen, M.H.

PY - 1994

Y1 - 1994

KW - additives

KW - copper electrolysis

KW - additives

KW - copper electrolysis

KW - additives

KW - copper electrolysis

M3 - Working paper

BT - Effect of gelatine and thiourea on the electrodeposition of copper

CY - Tukholma

ER -