Design for reliability of Au-Sn and Cu-Sn based SLID bonds

Vesa Vuorinen*, Antti Rautiainen, Mervi Paulasto-Kröckel

*Tämän työn vastaava kirjoittaja

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussaConference contributionScientificvertaisarvioitu

Abstrakti

Solid-Liquid Interdiffusion (SLID) bonding is a novel and attractive method for producing high strength, high melting point and microstructurally stabile interconnections for power electronic components, 3D packaging solutions and hermetic encapsulation for MEMS devices. However, there are quite a few different types of manufacturing related defects, which can have a significant effect on functionality and reliability performance of the SLID interconnections. With proper design for manufacturability i.e. by selecting the correct materials and by controlling their purity as well as by utilizing the optimal process parameters, the amount and effects of these defects can be minimized. In addition, in order to control the formation and evolution of the interconnection microstructure for high mechanical reliability the compatibility between the bonding materials and contact metallizations must be unambiguously defined and ensured.

AlkuperäiskieliEnglanti
Otsikko20th European Microelectronics and Packaging Conference and Exhibition
KustantajaIEEE
Sivumäärä6
ISBN (elektroninen)978-0-9568-0862-2
ISBN (painettu)978-0-9568086-1-5
TilaJulkaistu - 25 tammikuuta 2016
OKM-julkaisutyyppiA4 Artikkeli konferenssijulkaisuussa
TapahtumaEuropean Microelectronics and Packaging Conference - Friedrichshafen, Saksa
Kesto: 14 syyskuuta 201516 syyskuuta 2015
Konferenssinumero: 20

Conference

ConferenceEuropean Microelectronics and Packaging Conference
LyhennettäEMPC
MaaSaksa
KaupunkiFriedrichshafen
Ajanjakso14/09/201516/09/2015

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  • Siteeraa tätä

    Vuorinen, V., Rautiainen, A., & Paulasto-Kröckel, M. (2016). Design for reliability of Au-Sn and Cu-Sn based SLID bonds. teoksessa 20th European Microelectronics and Packaging Conference and Exhibition [7390735] IEEE.