D-Band Antenna and Array Designs for 5G Applications

Antti Lamminen; Mikko Kaunisto; Jussi Säily; Mikko Kantanen; Mario Schober; Alberto Chico; Juha Ala-Laurinaho; Vladimir Ermolov

doi:10.1109/EuCNC/6GSummit58263.2023.10188240

D-Band Antenna and Array Designs for 5G Applications

Antti Lamminen
, Mikko Kaunisto
, Jussi Säily
, Mikko Kantanen
, Mario Schober
, Alberto Chico
, Juha Ala-Laurinaho
, Vladimir Ermolov

VTT Technical Research Centre of Finland Ltd.
Advanced Technologies & Solutions
TTI Norte, S.L

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

5 Sitaatiot (Scopus)

79 Lataukset (Pure)

Abstrakti

This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.

Alkuperäiskieli	Englanti
Otsikko	2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023
Kustantaja	IEEE
Sivut	597-601
Sivumäärä	5
ISBN (elektroninen)	979-8-3503-1102-0
DOI - pysyväislinkit	https://doi.org/10.1109/EuCNC/6GSummit58263.2023.10188240
Tila	Julkaistu - 2023
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa
Tapahtuma	Joint European Conference on Networks and Communications and 6G Summit - Gothenburg, Ruotsi Kesto: 6 kesäk. 2023 → 9 kesäk. 2023

Julkaisusarja

Nimi	European conference on networks and communications
ISSN (elektroninen)	2575-4912

Conference

Conference	Joint European Conference on Networks and Communications and 6G Summit
Lyhennettä	EuCNC/6G
Maa/Alue	Ruotsi
Kaupunki	Gothenburg
Ajanjakso	06/06/2023 → 09/06/2023

Rahoitus

This work was conducted within the framework of the H2020 DRAGON project, which is partially funded by the Commission of the European Union (Grant Agreement No. 955699).

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Pääsy asiakirjaan

10.1109/EuCNC/6GSummit58263.2023.10188240

Lamminen_D-band_antenna_and_arrayAccepted author manuscript, 1,47 MB

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Lamminen, A., Kaunisto, M., Säily, J., Kantanen, M., Schober, M., Chico, A., Ala-Laurinaho, J., & Ermolov, V. (2023). D-Band Antenna and Array Designs for 5G Applications. teoksessa 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023 (Sivut 597-601). (European conference on networks and communications). IEEE. https://doi.org/10.1109/EuCNC/6GSummit58263.2023.10188240

@inproceedings{1224e27d2a264243aa4870206b2f61c2,

title = "D-Band Antenna and Array Designs for 5G Applications",

abstract = "This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.",

keywords = "antenna, antenna array, D-band, millimeter waves",

author = "Antti Lamminen and Mikko Kaunisto and Jussi S{\"a}ily and Mikko Kantanen and Mario Schober and Alberto Chico and Juha Ala-Laurinaho and Vladimir Ermolov",

note = "Funding Information: This work was conducted within the framework of the H2020 DRAGON project, which is partially funded by the Commission of the European Union (Grant Agreement No. 955699). Publisher Copyright: {\textcopyright} 2023 IEEE.; Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G ; Conference date: 06-06-2023 Through 09-06-2023",

year = "2023",

doi = "10.1109/EuCNC/6GSummit58263.2023.10188240",

language = "English",

series = "European conference on networks and communications",

publisher = "IEEE",

pages = "597--601",

booktitle = "2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023",

address = "United States",

}

Lamminen, A, Kaunisto, M, Säily, J, Kantanen, M, Schober, M, Chico, A, Ala-Laurinaho, J & Ermolov, V 2023, D-Band Antenna and Array Designs for 5G Applications. julkaisussa 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023. European conference on networks and communications, IEEE, Sivut 597-601, Joint European Conference on Networks and Communications and 6G Summit, Gothenburg, Ruotsi, 06/06/2023. https://doi.org/10.1109/EuCNC/6GSummit58263.2023.10188240

D-Band Antenna and Array Designs for 5G Applications. / Lamminen, Antti; Kaunisto, Mikko; Säily, Jussi et al.
2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023. IEEE, 2023. s. 597-601 (European conference on networks and communications).

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

TY - GEN

T1 - D-Band Antenna and Array Designs for 5G Applications

AU - Lamminen, Antti

AU - Kaunisto, Mikko

AU - Säily, Jussi

AU - Kantanen, Mikko

AU - Schober, Mario

AU - Chico, Alberto

AU - Ala-Laurinaho, Juha

AU - Ermolov, Vladimir

N1 - Funding Information: This work was conducted within the framework of the H2020 DRAGON project, which is partially funded by the Commission of the European Union (Grant Agreement No. 955699). Publisher Copyright: © 2023 IEEE.

PY - 2023

Y1 - 2023

N2 - This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.

AB - This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.

KW - antenna

KW - antenna array

KW - D-band

KW - millimeter waves

UR - https://www.scopus.com/pages/publications/85168419808

U2 - 10.1109/EuCNC/6GSummit58263.2023.10188240

DO - 10.1109/EuCNC/6GSummit58263.2023.10188240

M3 - Conference article in proceedings

AN - SCOPUS:85168419808

T3 - European conference on networks and communications

SP - 597

EP - 601

BT - 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023

PB - IEEE

T2 - Joint European Conference on Networks and Communications and 6G Summit

Y2 - 6 June 2023 through 9 June 2023

ER -

D-Band Antenna and Array Designs for 5G Applications

Abstrakti

Julkaisusarja

Conference

Rahoitus

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