Conductive Adhesives as Solder Replacement

Tutkimustuotos: Työpaperi › Working paper › Professional

Alkuperäiskieli	Englanti
Julkaisupaikka	Kööpenhamina
Sivut	25
Tila	Julkaistu - 1994
OKM-julkaisutyyppi	D4 Julkaistu kehittämis- tai tutkimusraportti taikka -selvitys

Nimi	Norad
Kustantaja	Technoconsult

Tutkimusalat

@techreport{75433adc05cb40e6909c880a6b4de70f,

title = "Conductive Adhesives as Solder Replacement",

keywords = "Anisotropic adhesives, solder replacement, Anisotropic adhesives, solder replacement, Anisotropic adhesives, solder replacement",

author = "P. Savolainen and J. Kivilahti",

year = "1994",

language = "English",

series = "Norad",

publisher = "Technoconsult",

pages = "25",

type = "WorkingPaper",

institution = "Technoconsult",

}

TY - UNPB

T1 - Conductive Adhesives as Solder Replacement

AU - Savolainen, P.

AU - Kivilahti, J.

PY - 1994

Y1 - 1994

KW - Anisotropic adhesives

KW - solder replacement

KW - Anisotropic adhesives

KW - solder replacement

KW - Anisotropic adhesives

KW - solder replacement

M3 - Working paper

T3 - Norad

SP - 25

BT - Conductive Adhesives as Solder Replacement

CY - Kööpenhamina

ER -