@article{8c109b36edf84a789d5efaec017fb390,
title = "Comparison of induced stresses due to electroless versus sputtered copper interconnect technology",
keywords = "copper, interconnect, micro-Raman spectroscopy, strain, stress, X-ray topography, copper, interconnect, micro-Raman spectroscopy, strain, stress, X-ray topography, copper, interconnect, micro-Raman spectroscopy, strain, stress, X-ray topography",
author = "P.J McNally and J. Kanatharana and B.H.W Toh and D.W McNeill and Turkka Tuomi and A.H Danilewsky and Lauri Knuuttila and Juha Riikonen and Juha Toivonen",
year = "2004",
language = "English",
volume = "19",
pages = "1280--1284",
journal = "Semiconductor Science and Technology",
issn = "1361-6641",
publisher = "Institute of Physics Publishing",
}