Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Elmeri Österlund; Vesa Vuorinen; Juha Jokilahti; Timo Galkin; Olli Salmela; Mervi Paulasto-Krockel

doi:10.1109/ESTC.2016.7764732

Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Elmeri Österlund
, Vesa Vuorinen
, Juha Jokilahti
, Timo Galkin
, Olli Salmela
, Mervi Paulasto-Krockel

Nokia Bell Labs

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

Abstrakti

ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

Alkuperäiskieli	Englanti
Otsikko	2016 6th Electronic System-Integration Technology Conference, ESTC 2016
Kustantaja	IEEE
Sivumäärä	5
ISBN (elektroninen)	978-1-5090-1402-6
DOI - pysyväislinkit	https://doi.org/10.1109/ESTC.2016.7764732
Tila	Julkaistu - 1 jouluk. 2016
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa
Tapahtuma	Electronic System Integration Technology Conference - Grenoble, Ranska Kesto: 13 syysk. 2016 → 16 syysk. 2016 Konferenssinumero: 6

Conference

Conference	Electronic System Integration Technology Conference
Lyhennettä	ESTC
Maa/Alue	Ranska
Kaupunki	Grenoble
Ajanjakso	13/09/2016 → 16/09/2016

Pääsy asiakirjaan

10.1109/ESTC.2016.7764732

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Link to publication in Scopus

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@inproceedings{ed6266ea1b0d49a9bdf8784d8f2085c2,

title = "Comparative study on radio frequency and reliability performance of electronically conductive adhesives",

abstract = "ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.",

author = "Elmeri {\"O}sterlund and Vesa Vuorinen and Juha Jokilahti and Timo Galkin and Olli Salmela and Mervi Paulasto-Krockel",

year = "2016",

month = dec,

day = "1",

doi = "10.1109/ESTC.2016.7764732",

language = "English",

booktitle = "2016 6th Electronic System-Integration Technology Conference, ESTC 2016",

publisher = "IEEE",

address = "United States",

note = "Electronic System Integration Technology Conference, ESTC ; Conference date: 13-09-2016 Through 16-09-2016",

}

Österlund, E, Vuorinen, V, Jokilahti, J, Galkin, T, Salmela, O & Paulasto-Krockel, M 2016, Comparative study on radio frequency and reliability performance of electronically conductive adhesives. julkaisussa 2016 6th Electronic System-Integration Technology Conference, ESTC 2016., 7764732, IEEE, Electronic System Integration Technology Conference, Grenoble, Ranska, 13/09/2016. https://doi.org/10.1109/ESTC.2016.7764732

Comparative study on radio frequency and reliability performance of electronically conductive adhesives. / Österlund, Elmeri; Vuorinen, Vesa; Jokilahti, Juha et al.
2016 6th Electronic System-Integration Technology Conference, ESTC 2016. IEEE, 2016. 7764732.

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

TY - GEN

T1 - Comparative study on radio frequency and reliability performance of electronically conductive adhesives

AU - Österlund, Elmeri

AU - Vuorinen, Vesa

AU - Jokilahti, Juha

AU - Galkin, Timo

AU - Salmela, Olli

AU - Paulasto-Krockel, Mervi

N1 - Conference code: 6

PY - 2016/12/1

Y1 - 2016/12/1

N2 - ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

AB - ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

UR - https://www.scopus.com/pages/publications/85015043158

U2 - 10.1109/ESTC.2016.7764732

DO - 10.1109/ESTC.2016.7764732

M3 - Conference article in proceedings

AN - SCOPUS:85015043158

BT - 2016 6th Electronic System-Integration Technology Conference, ESTC 2016

PB - IEEE

T2 - Electronic System Integration Technology Conference

Y2 - 13 September 2016 through 16 September 2016

ER -

Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Abstrakti

Conference

Pääsy asiakirjaan

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