@techreport{b34c59d36a634ab782e4a9099e59e50f,
title = "CAS2 - Solidification analysis package for binary copper alloys, user manual of DOS version 2.0.0",
keywords = "copper alloys, diffusion, material properties, microstructure, solidification, thermodynamics, copper alloys, diffusion, material properties, microstructure, solidification, thermodynamics, copper alloys, diffusion, material properties, microstructure, solidification, thermodynamics",
author = "Jyrki Miettinen",
year = "2004",
language = "English",
isbn = "951-22-7458-2",
series = "Teknillisen korkeakoulun materiaalitekniikan ja metallurgian julkaisuja",
publisher = "Teknillinen korkeakoulu",
number = "TKK-MK-162",
pages = "25",
type = "WorkingPaper",
institution = "Teknillinen korkeakoulu",
}