Boundary Conditions for Using Anisotropic Adhesives for Flip-Chip Bonding

P. Savolainen; J. Kivilahti

Boundary Conditions for Using Anisotropic Adhesives for Flip-Chip Bonding

P. Savolainen
, J. Kivilahti

Sähkötekniikan ja automaation laitos

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference article in proceedings › Scientific › vertaisarvioitu

Alkuperäiskieli	Englanti
Otsikko	The Proc. of Second European Conference on Microelectronics Packaging, Essen Germany, 1-3.2 1996
Sivut	51
Tila	Julkaistu - 1996
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisussa

Tutkimusalat

anisotropic adhesives
boundary conditions
flip-chip

Siteeraa tätä

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title = "Boundary Conditions for Using Anisotropic Adhesives for Flip-Chip Bonding",

keywords = "anisotropic adhesives, boundary conditions, flip-chip, anisotropic adhesives, boundary conditions, flip-chip, anisotropic adhesives, boundary conditions, flip-chip",

author = "P. Savolainen and J. Kivilahti",

year = "1996",

language = "English",

pages = "51",

booktitle = "The Proc. of Second European Conference on Microelectronics Packaging, Essen Germany, 1-3.2 1996",

}

TY - GEN

T1 - Boundary Conditions for Using Anisotropic Adhesives for Flip-Chip Bonding

AU - Savolainen, P.

AU - Kivilahti, J.

PY - 1996

Y1 - 1996

KW - anisotropic adhesives

KW - boundary conditions

KW - flip-chip

KW - anisotropic adhesives

KW - boundary conditions

KW - flip-chip

KW - anisotropic adhesives

KW - boundary conditions

KW - flip-chip

M3 - Conference article in proceedings

SP - 51

BT - The Proc. of Second European Conference on Microelectronics Packaging, Essen Germany, 1-3.2 1996

ER -