Biocompatible ALD barrier coatings for medical devices

Mikko Matvejeff; Satu Ek; Riina Ritasalo; Jesse Kalliomaki; Paivi Jarvinen; Oili Ylivaara; Erik Ostreng

doi:10.1109/EDTM.2017.7947504

Biocompatible ALD barrier coatings for medical devices

Mikko Matvejeff^*, Satu Ek, Riina Ritasalo, Jesse Kalliomaki, Paivi Jarvinen, Oili Ylivaara, Erik Ostreng

^*Tämän työn vastaava kirjoittaja

Ei julkaistu Aalto-yliopiston affiliaatiolla

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussa › Conference contribution › Scientific › vertaisarvioitu

Abstrakti

Atomic layer deposition (ALD) is widely in use for depositing a variety of materials, such as metal oxides, metal nitrides and metals, in a conformal and defectfree form at low temperatures on high aspect-ratio substrates. These advantages make ALD uniquely powerful method for applications where sensitive substrate materials combine with extreme demands on coating quality and temperature/ chemical resistance, such as those often seen in the medical applications.

Alkuperäiskieli	Englanti
Otsikko	2017 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM)
Kustantaja	IEEE
Sivut	56-58
Sivumäärä	3
ISBN (elektroninen)	978-1-5090-4660-7
DOI - pysyväislinkit	https://doi.org/10.1109/EDTM.2017.7947504
Tila	Julkaistu - 2017
OKM-julkaisutyyppi	A4 Artikkeli konferenssijulkaisuussa
Tapahtuma	IEEE Electron Devices Technology and Manufacturing Conference - Toyama, Japani Kesto: 28 helmik. 2017 → 2 maalisk. 2017

Conference

Conference	IEEE Electron Devices Technology and Manufacturing Conference
Lyhennettä	EDTM
Maa/Alue	Japani
Kaupunki	Toyama
Ajanjakso	28/02/2017 → 02/03/2017

Pääsy asiakirjaan

10.1109/EDTM.2017.7947504

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@inproceedings{224ae64243ac44b289654590d3fd064f,

title = "Biocompatible ALD barrier coatings for medical devices",

abstract = "Atomic layer deposition (ALD) is widely in use for depositing a variety of materials, such as metal oxides, metal nitrides and metals, in a conformal and defectfree form at low temperatures on high aspect-ratio substrates. These advantages make ALD uniquely powerful method for applications where sensitive substrate materials combine with extreme demands on coating quality and temperature/ chemical resistance, such as those often seen in the medical applications.",

keywords = "ALD, medical device and barrier layer, ATOMIC LAYER DEPOSITION",

author = "Mikko Matvejeff and Satu Ek and Riina Ritasalo and Jesse Kalliomaki and Paivi Jarvinen and Oili Ylivaara and Erik Ostreng",

year = "2017",

doi = "10.1109/EDTM.2017.7947504",

language = "English",

pages = "56--58",

booktitle = "2017 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM)",

publisher = "IEEE",

address = "United States",

note = "IEEE Electron Devices Technology and Manufacturing Conference, EDTM ; Conference date: 28-02-2017 Through 02-03-2017",

}

Matvejeff, M, Ek, S, Ritasalo, R, Kalliomaki, J, Jarvinen, P, Ylivaara, O & Ostreng, E 2017, Biocompatible ALD barrier coatings for medical devices. julkaisussa 2017 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM). IEEE, Sivut 56-58, IEEE Electron Devices Technology and Manufacturing Conference, Toyama, Japani, 28/02/2017. https://doi.org/10.1109/EDTM.2017.7947504

TY - GEN

T1 - Biocompatible ALD barrier coatings for medical devices

AU - Matvejeff, Mikko

AU - Ek, Satu

AU - Ritasalo, Riina

AU - Kalliomaki, Jesse

AU - Jarvinen, Paivi

AU - Ylivaara, Oili

AU - Ostreng, Erik

PY - 2017

Y1 - 2017

N2 - Atomic layer deposition (ALD) is widely in use for depositing a variety of materials, such as metal oxides, metal nitrides and metals, in a conformal and defectfree form at low temperatures on high aspect-ratio substrates. These advantages make ALD uniquely powerful method for applications where sensitive substrate materials combine with extreme demands on coating quality and temperature/ chemical resistance, such as those often seen in the medical applications.

AB - Atomic layer deposition (ALD) is widely in use for depositing a variety of materials, such as metal oxides, metal nitrides and metals, in a conformal and defectfree form at low temperatures on high aspect-ratio substrates. These advantages make ALD uniquely powerful method for applications where sensitive substrate materials combine with extreme demands on coating quality and temperature/ chemical resistance, such as those often seen in the medical applications.

KW - ALD

KW - medical device and barrier layer

KW - ATOMIC LAYER DEPOSITION

U2 - 10.1109/EDTM.2017.7947504

DO - 10.1109/EDTM.2017.7947504

M3 - Conference contribution

SP - 56

EP - 58

BT - 2017 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM)

PB - IEEE

T2 - IEEE Electron Devices Technology and Manufacturing Conference

Y2 - 28 February 2017 through 2 March 2017

ER -

Biocompatible ALD barrier coatings for medical devices

Abstrakti

Conference

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