A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussavertaisarvioitu

Standard

A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model. / Gerstner, Philip; Ridgway, Cathy J.; Paltakari, Jouni; Gane, Patrick A.C.

International Student Conference Printing Future Days, Chemnitz, Germany, 2009. 2009. s. 259-266.

Tutkimustuotos: Artikkeli kirjassa/konferenssijulkaisussavertaisarvioitu

Harvard

Gerstner, P, Ridgway, CJ, Paltakari, J & Gane, PAC 2009, A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model. julkaisussa International Student Conference Printing Future Days, Chemnitz, Germany, 2009. Sivut 259-266.

APA

Gerstner, P., Ridgway, C. J., Paltakari, J., & Gane, P. A. C. (2009). A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model. teoksessa International Student Conference Printing Future Days, Chemnitz, Germany, 2009 (Sivut 259-266)

Vancouver

Gerstner P, Ridgway CJ, Paltakari J, Gane PAC. A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model. julkaisussa International Student Conference Printing Future Days, Chemnitz, Germany, 2009. 2009. s. 259-266

Author

Gerstner, Philip ; Ridgway, Cathy J. ; Paltakari, Jouni ; Gane, Patrick A.C. / A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model. International Student Conference Printing Future Days, Chemnitz, Germany, 2009. 2009. Sivut 259-266

Bibtex - Lataa

@inproceedings{9e3986c224c44bcd8c6c67ac07b50e1d,
title = "A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model",
keywords = "coating structure, electrophotography, heatset offset, modelling, particle deposition, Porous media, thermal calendering, thermal conductivity, web drying, coating structure, electrophotography, heatset offset, modelling, particle deposition, Porous media, thermal calendering, thermal conductivity, web drying, coating structure, electrophotography, heatset offset, modelling, particle deposition, Porous media, thermal calendering, thermal conductivity, web drying",
author = "Philip Gerstner and Ridgway, {Cathy J.} and Jouni Paltakari and Gane, {Patrick A.C.}",
year = "2009",
language = "English",
pages = "259--266",
booktitle = "International Student Conference Printing Future Days, Chemnitz, Germany, 2009",

}

RIS - Lataa

TY - GEN

T1 - A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model

AU - Gerstner, Philip

AU - Ridgway, Cathy J.

AU - Paltakari, Jouni

AU - Gane, Patrick A.C.

PY - 2009

Y1 - 2009

KW - coating structure

KW - electrophotography

KW - heatset offset

KW - modelling

KW - particle deposition

KW - Porous media

KW - thermal calendering

KW - thermal conductivity

KW - web drying

KW - coating structure

KW - electrophotography

KW - heatset offset

KW - modelling

KW - particle deposition

KW - Porous media

KW - thermal calendering

KW - thermal conductivity

KW - web drying

KW - coating structure

KW - electrophotography

KW - heatset offset

KW - modelling

KW - particle deposition

KW - Porous media

KW - thermal calendering

KW - thermal conductivity

KW - web drying

M3 - Conference contribution

SP - 259

EP - 266

BT - International Student Conference Printing Future Days, Chemnitz, Germany, 2009

ER -

ID: 2369517