A Solder Alloy Filled Z-Axis Conductive Adhesive

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Alkuperäiskieli	Englanti
Sivut	187-196
Julkaisu	Journal of Adhesion
Vuosikerta	49
Numero	3-4
Tila	Julkaistu - 1995
OKM-julkaisutyyppi	A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Tutkimusalat

@article{8a980cf83896424ea8ed05ac6698eee5,

title = "A Solder Alloy Filled Z-Axis Conductive Adhesive",

keywords = "conductive adhesive, microelectronics, conductive adhesive, microelectronics, conductive adhesive, microelectronics",

author = "P. Savolainen and J. Kivilahti",

year = "1995",

language = "English",

volume = "49",

pages = "187--196",

journal = "Journal of Adhesion",

issn = "1563-518X",

publisher = "Taylor \& Francis",

number = "3-4",

}

TY - JOUR

T1 - A Solder Alloy Filled Z-Axis Conductive Adhesive

AU - Savolainen, P.

AU - Kivilahti, J.

PY - 1995

Y1 - 1995

KW - conductive adhesive

KW - microelectronics

KW - conductive adhesive

KW - microelectronics

KW - conductive adhesive

KW - microelectronics

M3 - Article

SN - 1563-518X

VL - 49

SP - 187

EP - 196

JO - Journal of Adhesion

JF - Journal of Adhesion

IS - 3-4

ER -