Engineering & Materials Science
Interdiffusion (solids)
100%
Intermetallics
45%
Aluminum nitride
41%
Liquids
37%
MEMS
33%
Annealing
33%
Diffusion bonding
25%
Thin films
22%
Silicon
22%
Electroplating
21%
Residual stresses
20%
Piezoelectric devices
19%
Impurities
19%
Microstructure
17%
Metallizing
17%
Temperature
16%
Metallorganic chemical vapor deposition
14%
Atomic layer deposition
14%
Secondary ion mass spectrometry
14%
Microstructural evolution
13%
Wafer bonding
13%
Power semiconductor diodes
12%
Copper
11%
Chlorine
11%
Passivation
11%
Crystalline materials
11%
Platinum
10%
Polysilicon
10%
Plasmas
10%
Diffraction
10%
Metallurgy
9%
Crystals
9%
Hot Temperature
9%
Ternary systems
9%
Multilayers
9%
Transducers
8%
X rays
8%
Vacancies
8%
Atmospheric humidity
8%
Isothermal annealing
8%
Ultrasonics
7%
Fabrication
7%
Scandium
7%
Electrodes
7%
Encapsulation
7%
Silicon wafers
6%
Chemical activation
6%
Current density
6%
Glass
5%
Piezoelectricity
5%
Chemical Compounds
Intermetallic Compound
48%
Aluminium Nitride
36%
Residual Stress
34%
Electrodeposition
31%
Annealing
30%
Liquid
22%
Microstructure
21%
Ternary System
18%
Metallurgy
17%
Interdiffusion
14%
Thermal Aging
12%
Liquid Film
11%
Microelectronics
10%
Chemical Passivation
9%
Hexagonal Space Group
9%
Chemical Vapour Deposition
8%
Chlorine
8%
Piezoelectricity
7%
Time of Flight Mass Spectroscopy
7%
Semiconductor
7%
Surface
6%
Industry
6%
Platinum
6%
Plasma
6%
Diffusion
6%
Strength
5%
Simulation
5%
Soldering
5%
Physics & Astronomy
voids
24%
intermetallics
23%
wafers
20%
metalorganic chemical vapor deposition
17%
metal bonding
14%
residual stress
14%
aluminum nitrides
14%
annealing
13%
liquids
13%
microstructure
13%
diffusion welding
12%
semiconductor diodes
11%
electroplating
11%
microelectromechanical systems
10%
SOI (semiconductors)
10%
packaging
9%
atomic layer epitaxy
9%
secondary ion mass spectrometry
9%
wurtzite
9%
humidity
9%
transducers
9%
platinum
9%
passivity
8%
deflection
8%
electric contacts
8%
x ray diffraction
8%
silicon
7%
ultrasonics
7%
insulators
6%
microscopy
6%
thin films
6%
tensile stress
6%
scanning
5%
electrodes
5%
temperature
5%
acoustics
5%
ternary systems
5%
membranes
5%
crystals
5%
