High-Resolution inspection for bonding voids in Solid-Liquid-Interdiffusion (SLID) bond interfaces by Acoustic GHz-Microscopy

Description

Solid-Liquid-Interdiffusion (SLID) bonding is promising for formation of:
-Bond frames and hermetic seals for MEMS
-Micro-connects for 3D integration in microelectronics
-Die attach for power semiconductors
Major advantages:
-Formation of high-temperature stable bonds processed at low temperatures
High strength
GHz-SAM allows defect detection down to few 100 nm diameter through a few µm of remnant Si
Application to bond quality analysis for process development studied with respect to small voids

Aikajakso	27 marrask. 2017 → 29 marrask. 2017
Tapahtuman otsikko	Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
Tapahtuman tyyppi	Conference
Sijainti	Leuven, BelgiaNäytä kartalla
Tunnustuksen arvo	International