Wetting Reaction vs.Solid State Aging of Eutectic SnPb on Cu

K-N. Tu, T.Y. Lee, J.W. Jang, L. Li, D.R. Frear, K. Zeng, Jorma K. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)4843-4849
    JournalJournal of Applied Physics
    Volume89
    Publication statusPublished - 2001
    MoE publication typeA1 Journal article-refereed

    Keywords

    • aging
    • copper
    • eutectic SnPb
    • wetting reaction

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