Wafer-level SLID bonding for MEMS encapsulation

Hongbo Xu, Tommi Suni, Vesa Vuorinen, Jue Li, Hannele Heikkinen, Philippe Monnoyer, Mervi Paulasto-Kröckel

Research output: Contribution to journalArticleScientificpeer-review

23 Citations (Scopus)
Original languageEnglish
Pages (from-to)226-235
JournalAdvances in Manufacturing
Volume1
Issue number3
DOIs
Publication statusPublished - 2013
MoE publication typeA1 Journal article-refereed

Keywords

  • (MEMS) Solid-liquid interdiffusion (SLID)
  • bonding Transient liquid-phase (TLP) bonding
  • Defects Shear test Reliability
  • Micro electronic mechanical system

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