| Original language | English |
|---|---|
| Publication status | Published - 2003 |
| MoE publication type | D4 Published development or research report or study |
Publication series
| Name | Nordic Semiconductor Meeting 2003, Tampere, Finland |
|---|
Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist
S. Tuomikoski, S. Franssila
Research output: Working paper › Professional
23
Citations
(Scopus)