Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist

S. Tuomikoski, S. Franssila

Research output: Contribution to journalArticleScientificpeer-review

23 Citations (Scopus)
Original languageEnglish
Pages (from-to)223-226
JournalPhysica Scripta
Issue numberT114
Publication statusPublished - 2004
MoE publication typeA1 Journal article-refereed

Keywords

  • adhesive bonding
  • microchannel and cavity
  • photoresist
  • SU-8

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