Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist

S. Tuomikoski; S. Franssila

Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist

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Research output: Contribution to journal › Article › Scientific › peer-review

23 Citations (Scopus)

Original language	English
Pages (from-to)	223-226
Journal	Physica Scripta
Issue number	T114
Publication status	Published - 2004
MoE publication type	A1 Journal article-refereed

Keywords

adhesive bonding
microchannel and cavity
photoresist
SU-8

Access to Document

http://www.physica.org/asp/document.asp?article=114p01a00223

Cite this

@article{19b4e4f7727b4f0087dbeb2a18e84031,

title = "Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist",

keywords = "adhesive bonding, microchannel and cavity, photoresist, SU-8, adhesive bonding, microchannel and cavity, photoresist, SU-8, adhesive bonding, microchannel and cavity, photoresist, SU-8",

author = "S. Tuomikoski and S. Franssila",

year = "2004",

language = "English",

pages = "223--226",

journal = "Physica Scripta ",

issn = "0031-8949",

publisher = "IOP Publishing Ltd.",

number = "T114",

}

TY - JOUR

T1 - Wafer-level bonding of MEMS structures with SU-8 epoxy photoresist

AU - Tuomikoski, S.

AU - Franssila, S.

PY - 2004

Y1 - 2004

KW - adhesive bonding

KW - microchannel and cavity

KW - photoresist

KW - SU-8

KW - adhesive bonding

KW - microchannel and cavity

KW - photoresist

KW - SU-8

KW - adhesive bonding

KW - microchannel and cavity

KW - photoresist

KW - SU-8

UR - http://www.physica.org/asp/document.asp?article=114p01a00223

M3 - Article

SP - 223

EP - 226

JO - Physica Scripta

JF - Physica Scripta

SN - 0031-8949

IS - T114

ER -