Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

Tomi Suni, Hongbo Xu, Vesa Vuorinen, Hannele Heikkinen, Sami Vähänen, Antti Jaakkola, Philippe Monnoyer, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

6 Citations (Scopus)
Original languageEnglish
Title of host publicationEurope Microelectronics Packaging Conference, Grenoble, France, 10-12.09.2013
Place of PublicationGrenoble, France
Publication statusPublished - 2013
MoE publication typeA4 Article in a conference publication

Publication series

NameEuropean Microelectronics Packaging Conference
ISSN (Print)2165-2341

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