Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

Tomi Suni; Hongbo Xu; Vesa Vuorinen; Hannele Heikkinen; Sami Vähänen; Antti Jaakkola; Philippe Monnoyer; Mervi Paulasto-Kröckel

Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

Tomi Suni, Hongbo Xu, Vesa Vuorinen, Hannele Heikkinen, Sami Vähänen, Antti Jaakkola, Philippe Monnoyer, Mervi Paulasto-Kröckel

Electronics Integration and Reliability

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

7 Citations (Scopus)

Original language	English
Title of host publication	Europe Microelectronics Packaging Conference, Grenoble, France, 10-12.09.2013
Place of Publication	Grenoble, France
Publication status	Published - 2013
MoE publication type	A4 Conference publication

Publication series

Name	European Microelectronics Packaging Conference
ISSN (Print)	2165-2341

Cite this

@inproceedings{8fc2855868464ba98dc9293c9ea67423,

title = "Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation",

author = "Tomi Suni and Hongbo Xu and Vesa Vuorinen and Hannele Heikkinen and Sami V{\"a}h{\"a}nen and Antti Jaakkola and Philippe Monnoyer and Mervi Paulasto-Kr{\"o}ckel",

year = "2013",

language = "English",

isbn = "978-2-95-274671-7",

series = "European Microelectronics Packaging Conference",

booktitle = "Europe Microelectronics Packaging Conference, Grenoble, France, 10-12.09.2013",

}

Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation. / Suni, Tomi; Xu, Hongbo; Vuorinen, Vesa et al.
Europe Microelectronics Packaging Conference, Grenoble, France, 10-12.09.2013. Grenoble, France, 2013. (European Microelectronics Packaging Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

AU - Suni, Tomi

AU - Xu, Hongbo

AU - Vuorinen, Vesa

AU - Heikkinen, Hannele

AU - Vähänen, Sami

AU - Jaakkola, Antti

AU - Monnoyer, Philippe

AU - Paulasto-Kröckel, Mervi

PY - 2013

Y1 - 2013

M3 - Conference article in proceedings

SN - 978-2-95-274671-7

T3 - European Microelectronics Packaging Conference

BT - Europe Microelectronics Packaging Conference, Grenoble, France, 10-12.09.2013

CY - Grenoble, France

ER -