Void Formation in Cu-Sn Micro-Connects

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

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Details

Original languageEnglish
Title of host publicationElectronic Components and Technology Conference (ECTC), San Diego CA, 26-29 May 2015
EditorsBeth Keser, Henning Braunisch
Publication statusPublished - 2015
MoE publication typeB3 Non-refereed article in conference proceedings

Publication series

NameElectronic Components and Technology Conference
ISSN (Print)0569-5503

ID: 1955247