Vertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test

Antti Rautiainen*, Vesa Vuorinen, Jue Li, Mervi Paulasto-Kröckel

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

4 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds