Vertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test

Antti Rautiainen*, Vesa Vuorinen, Jue Li, Mervi Paulasto-Kröckel

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

4 Citations (Scopus)


Copper-tin solid-liquid interdiffusion (SLID) bonding technique results hermetic, high re-melting temperature and mechanically strong interconnections for e.g. MEMS applications. However, the long-term reliability is not well-known and Cu-Sn system often suffers from voiding phenomenon. In this communication, the literature related to voiding is reviewed, as well as the effect of voiding level, arising from the copper electroplating bath condition and plating parameters, to the observed vertical cracking is experimentally studied under thermal shock test. In addition, finite element method is applied to reason the direction of crack propagation, and to study the effect of voiding to the relative stress level.

Original languageEnglish
Title of host publicationProceedings of the 2nd International Conference on Integrated Functional nano Systems, nanoFIS 2016
EditorsAnton Köck
Number of pages10
Publication statusPublished - 2017
MoE publication typeA4 Article in a conference publication
EventInternational Conference on Integrated Functional Nano Systems - Graz, Austria
Duration: 27 Jun 201729 Jun 2017
Conference number: 2

Publication series

NameMaterials Today: Proceedings
Number7, Part 2
ISSN (Electronic)2214-7853


ConferenceInternational Conference on Integrated Functional Nano Systems
Abbreviated titlenanoFIS


  • Bonding
  • Intermetallic compound
  • Solid-liquid interdiffusion
  • Vertical crack
  • Voiding


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