@article{4c18cf607c374fbf96128c4227140e6b,
title = "Uutta tietoa elektroniikkateollisuuden juoteliitosten kest{\"a}vyydest{\"a}",
keywords = "crack propagation, electronic device, fatique cyclic load, plastic, solder joints, thermal expansion, tin-lead joint, viscous deformation, crack propagation, electronic device, fatique cyclic load, plastic, solder joints, thermal expansion, tin-lead joint, viscous deformation, crack propagation, electronic device, fatique cyclic load, plastic, solder joints, thermal expansion, tin-lead joint, viscous deformation",
author = "P. Marjam{\"a}ki",
year = "1998",
language = "Suomi",
pages = "46--47",
journal = "Rnet",
number = "2",
}